Invention Grant
- Patent Title: Resealable laminate for heat sealed packaging
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Application No.: US16891686Application Date: 2020-06-03
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Publication No.: US11352172B2Publication Date: 2022-06-07
- Inventor: Xinrong Duan , Martin Daffner , ZhiJian Xue
- Applicant: Avery Dennison Corporation
- Applicant Address: US CA Glendale
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Glendale
- Agency: Avery Dennison Corporation
- Main IPC: B32B27/32
- IPC: B32B27/32 ; B65D33/20 ; B65D75/58 ; B32B7/06 ; B32B27/18 ; B32B27/40 ; B32B25/14 ; B32B27/30 ; B32B25/08 ; B32B27/34 ; B32B27/36 ; B32B7/12 ; B32B27/10 ; B32B27/28 ; B32B7/03 ; B65D33/00 ; B65D33/24 ; B32B27/08 ; B65D65/14 ; B65D65/40

Abstract:
A resealable package assembly is described. The package assembly includes a selectively positionable flap that covers an aperture or enables access through the aperture into the package. The flap and package include provisions for releasably engaging the flap to the package to seal the interior of the package. Provisions for grasping the tab and indicating whether tampering has occurred are also described.
Public/Granted literature
- US20200290774A1 Resealable Laminate for Heat Sealed Packaging Public/Granted day:2020-09-17
Information query