An electronic integrated circuit (IC) component is mounted to a substrate. A cap member is applied onto the substrate and covers the electronic IC component. The cap member includes an outer wall defining an opening and an inner wall surrounding the electronic IC component. The inner wall extends from a proximal end at the substrate towards a distal end facing the opening in the outer wall to provide a reception chamber for the electronic IC component and a peripheral chamber between the inner wall and the outer wall of the cap member. An encapsulant material is provided in the reception chamber to seal the electronic IC component without being present in the peripheral chamber.