Invention Grant
- Patent Title: Resin composition and resin molded article
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Application No.: US16941625Application Date: 2020-07-29
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Publication No.: US11352493B2Publication Date: 2022-06-07
- Inventor: Akira Imada
- Applicant: FUJIFILM BUSINESS INNOVATION CORP.
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM BUSINESS INNOVATION CORP.
- Current Assignee: FUJIFILM BUSINESS INNOVATION CORP.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2020-055089 20200325
- Main IPC: C08L69/00
- IPC: C08L69/00 ; B29C45/00 ; C08G63/183 ; C08K5/00 ; C08K5/521 ; C08L27/18

Abstract:
A resin composition includes a polycarbonate-based resin and a polyethylene terephthalate resin, and the resin composition has a resin phase-separated structure including a continuous phase containing the polycarbonate-based resin and a dispersed phase containing the polyethylene terephthalate resin, in which a number average diameter in a longitudinal direction of the dispersed phase is 1.5 μm or less, a number average diameter in a lateral direction of the dispersed phase is 0.8 μm or less, and an aspect ratio of the number average diameter in the longitudinal direction to the number average diameter in the lateral direction is 2.5 or less.
Public/Granted literature
- US20210301128A1 RESIN COMPOSITION AND RESIN MOLDED ARTICLE Public/Granted day:2021-09-30
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