Invention Grant
- Patent Title: Package
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Application No.: US17287409Application Date: 2019-10-31
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Publication No.: US11352529B2Publication Date: 2022-06-07
- Inventor: Hidekazu Tanaka , Atsushi Sone , Tamio Shikano
- Applicant: ZEON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ZEON CORPORATION
- Current Assignee: ZEON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenja IP Law PC
- Priority: JPJP2018-207615 20181102
- International Application: PCT/JP2019/042902 WO 20191031
- International Announcement: WO2020/091004 WO 20200507
- Main IPC: B65D85/10
- IPC: B65D85/10 ; C09J11/08 ; B65D5/38 ; B65D5/66 ; B65D33/18 ; B65D77/10 ; B65D83/08 ; C09J151/08

Abstract:
The present disclosure is directed to provide a package which enables repeated opening and sealing of an opening, and can be favorably closed by bringing a pair of resin adhesive parts into contact with each other while preventing sticking of materials to each resin adhesive part. A package of the present disclosure comprises a main body having an internal space and an opening in communication between the internal space and an outside; and a pair of, i.e., two, resin adhesive parts which are disposed so as to be capable of being brought into contact with each other for sealing the opening. Here, the 90-degree peel force between the pair of resin adhesive parts is 0.02 N or more, the coefficient of dynamic friction of each of the two resin adhesive parts is 1.50 or less, and the tack force of each of the two resin adhesive parts is 1.60 N or less.
Public/Granted literature
- US20210388242A1 PACKAGE Public/Granted day:2021-12-16
Information query
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