Invention Grant
- Patent Title: Composition containing coolant, heat transfer medium and heat cycle system
-
Application No.: US17050278Application Date: 2019-04-18
-
Publication No.: US11352535B2Publication Date: 2022-06-07
- Inventor: Mitsushi Itano , Kazuhiro Takahashi , Yuuki Yotsumoto , Akihito Mizuno
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2018-084364 20180425
- International Application: PCT/JP2019/016618 WO 20190418
- International Announcement: WO2019/208384 WO 20191031
- Main IPC: C09K5/04
- IPC: C09K5/04 ; F25B9/00

Abstract:
The present disclosure provides a composition comprising a refrigerant characterized by having a low GWP, low flammability, a COP equivalent to that of R410A, and a refrigerating capacity almost equivalent to that of R410A. Specifically, the present disclosure provides a composition comprising a refrigerant, the refrigerant comprising CO2 (R744), hexafluoropropene (FO-1216), and at least one compound A selected from the group consisting of trifluoroethylene (HFO-1123), trans-1,2-difluoroethylene [(E)-HFO-1132], cis-1,2-difluoroethylene [(Z)-HFO-1132], fluoroethylene (HFO-1141), and 3,3,3-trifluoropropyne (TFP).
Public/Granted literature
- US20210079280A1 COMPOSITION CONTAINING COOLANT, HEAT TRANSFER MEDIUM AND HEAT CYCLE SYSTEM Public/Granted day:2021-03-18
Information query