Invention Grant
- Patent Title: Reversible self-locking interconnection system for modular integrated construction
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Application No.: US17128184Application Date: 2020-12-20
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Publication No.: US11352781B2Publication Date: 2022-06-07
- Inventor: Yanmin Wu , Juan Zhang , Yik Fung Lau , Honggang Zhu
- Applicant: Nano and Advanced Materials Institute Limited
- Applicant Address: HK Hong Kong
- Assignee: Nano and Advanced Materials Institute Limited
- Current Assignee: Nano and Advanced Materials Institute Limited
- Current Assignee Address: HK Hong Kong
- Agency: Idea Intellectual Limited
- Agent Margaret A. Burke; Sam T. Yip
- Main IPC: E04H1/00
- IPC: E04H1/00 ; E04B1/58 ; E04B1/348 ; E04B1/41 ; E04B1/38

Abstract:
A self-locking connection system for modular construction (e.g., MiC and PPVC) is provided for interlocking an upper module column to a lower module column. A horizontal load transfer plate has first and second inner sleeve portions positioned beneath and above the plate. The sleeves are configured and dimensioned to be received within the respective module columns. Spring-loaded latches in both sleeve portions engage respective column receiving apertures. Each latch may include a latch plate having a wedge-shaped latch protrusion connecting to a vertical latch surface. The latch plate has one or more latch plate apertures for receiving a rod within a coil spring. An optional second reversible self-locking mechanism interlocks the connected modules to a building load-bearing support such as a core wall. The second self-locking mechanism includes an angled protrusion extending from the horizontal load transfer plate to mate with a protrusion-receiving structure embedded in the load-bearing support.
Public/Granted literature
- US20220081895A1 REVERSIBLE SELF-LOCKING INTERCONNECTION SYSTEM FOR MODULAR INTEGRATED CONSTRUCTION Public/Granted day:2022-03-17
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