A semi-open high-temperature heat pump system including a compressor, a direct-contact condenser, a heat exchanger, an evaporator, a water purifier, a cold water pump, a hot water pump, a circulating water pump, and a vacuum pump. A discharge port of the compressor is connected to the direct-contact condenser, the direct-contact condenser is connected to the evaporator via the heat exchanger, and the evaporator is connected to a gas suction port of the compressor via a gas vent on its top. An outlet of the water purifier is separately connected to the compressor, the direct-contact condenser, and the evaporator via the cold water pump. An outlet at the bottom of the evaporator is connected to the direct-contact condenser via the circulating water pump. The vacuum pump is connected above the direct-contact condenser, and the hot water pump is connected below the direct-contact condenser.