Invention Grant
- Patent Title: Plate type heat exchanger
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Application No.: US16927028Application Date: 2020-07-13
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Publication No.: US11353268B2Publication Date: 2022-06-07
- Inventor: Jiwon Choi , Eungyul Lee , Hanchoon Lee
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates LLP
- Priority: KR10-2019-0091522 20190729
- Main IPC: F28D9/00
- IPC: F28D9/00 ; F28F3/04

Abstract:
A plate type heat exchanger includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate. The end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge that protrudes outward from an edge of the socket hole of the base.
Public/Granted literature
- US20210033349A1 PLATE TYPE HEAT EXCHANGER Public/Granted day:2021-02-04
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