Invention Grant
- Patent Title: Thermal imaging for within wafer variability feedforward or feedback information
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Application No.: US17249317Application Date: 2021-02-26
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Publication No.: US11353364B2Publication Date: 2022-06-07
- Inventor: William Dean Thompson
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: G01J5/00
- IPC: G01J5/00 ; H04N5/33 ; G01J5/48

Abstract:
IR radiation may be used to examine substrates prior to a fabrication operation in order to adjust processing parameters of the fabrication operation, or to determine features of the substrate. A thermographic image may be collected and provided to a transfer function or machine learning model to determine processing parameters or features. The processing parameters may improve the uniformity of the wafer and/or achieve a desired target feature value.
Public/Granted literature
- US20210270673A1 THERMAL IMAGING FOR WITHIN WAFER VARIABILITY FEEDFORWARD OR FEEDBACK INFORMATION Public/Granted day:2021-09-02
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