Disclosed are a method for measuring the adhesive strength of a thin film using surface waves, and a computer-readable recording medium having a program for performing same recorded thereon. The method for measuring the adhesive strength of a thin film measures the adhesive strength between a substrate and a thin film by means of an electronic calculator, using sound waves measured from a thin film structure having a thin film formed on a substrate. The method, which is performed by the electronic calculator, comprises the steps of: receiving, as a first input value, the thickness, density, longitudinal wave velocity, and shear wave velocity of a first thin film and a substrate the adhesive strength between which is to be measured; calculating, from the first input value, the thickness and density of a second thin film virtually configured between the first thin film and substrate, and setting as a second input value; calculating the longitudinal wave velocity and shear wave velocity of the second thin film according to the stiffness constant of the second thin film, while varying the stiffness constant, and setting as a third input value; using the first to third input values to acquire a transfer matrix between the first thin film, second thin film, and substrate; using the transfer matrix to calculate the dispersion characteristics of the speed of surface waves; and substituting, to dispersion curves, the propagation speed of the surface waves measured from the substrate having the first thin film formed thereon, in order to acquire the stiffness constant matching the propagation speed of the measured surface waves and measure the adhesive strength between the substrate and the thin film.