A test socket includes a pedestal. The pedestal includes a central pedestal including a central contact portion coming in contact with a central region of a bottom surface of a semiconductor package and a plurality of insertion holes formed to correspond to a plurality of solder balls projecting from the bottom surface of the semiconductor package, so as to allow the solder balls to be inserted into respective insertion holes. The pedestal further includes a circumferential pedestal separated from the central pedestal by a space having an opening width larger than a diameter of the insertion hole and including a circumferential contact portion coming in contact with a circumference of the bottom surface of the semiconductor package.