A method of patterning a substrate includes dispensing droplets of a resist onto a first region and a second region of a surface, pressing a patterned portion of an imprint template into the resist in the first region, curing the resist on the surface, and then removing the imprint template from the resist. An image of the resist in the second region is acquired to evaluate wettability of the resist. In some examples, the evaluation of wettability may be performed by image analysis on the acquired image and used in determining whether or not the patterning of the substrate was successful or likely to have been successful.