Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US16416374Application Date: 2019-05-20
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Publication No.: US11353792B2Publication Date: 2022-06-07
- Inventor: Norihisa Koga
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JPJP2018-097663 20180522
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F7/40
Abstract:
A substrate processing apparatus includes: a processing chamber configured to process a substrate; a light source chamber including a light source configured to irradiate vacuum ultraviolet light onto a surface of the substrate; a gas supply configured to supply an inert gas into the light source chamber; and a controller that controls the gas supply to maintain the light source chamber in an inert gas atmosphere.
Information query
IPC分类:
