Invention Grant
- Patent Title: Method of simulating resist pattern, resist material and method of optimizing formulation thereof, apparatus and recording medium
-
Application No.: US16545868Application Date: 2019-08-20
-
Publication No.: US11353793B2Publication Date: 2022-06-07
- Inventor: Seiji Nagahara
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2018-154270 20180820,JPJP2019-030674 20190222
- Main IPC: G05B19/4097
- IPC: G05B19/4097 ; G03F7/20 ; G03F7/004 ; G03F7/00

Abstract:
A method of simulating a resist pattern according to an exemplary embodiment includes a step (A) of calculating a latent image of a concentration of an active species in a resist film that has been radiated by a radioactive ray along a target pattern with respect to a radiation position of the radioactive ray, a step (B) of calculating a change rate of the concentration with respect to the radiation position at an edge of the target pattern on the basis of the latent image, a step (C) of calculating a probabilistic variation at the edge of the target pattern, and a step (D) of calculating a variation in pattern edge roughness from the change rate of the concentration and the probabilistic variation.
Public/Granted literature
Information query
IPC分类: