Invention Grant
- Patent Title: Modular computing component information transmission
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Application No.: US17048120Application Date: 2018-07-10
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Publication No.: US11354137B2Publication Date: 2022-06-07
- Inventor: Chi So , Nam H. Nguyen , Robert C. Brooks
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agent Fabian VanCott
- International Application: PCT/US2018/041362 WO 20180710
- International Announcement: WO2020/013807 WO 20200116
- Main IPC: G06F9/445
- IPC: G06F9/445 ; G06F13/10 ; G06F8/71 ; G06F9/4401

Abstract:
In one example in accordance with the present disclosure, a modular computing component is described. The modular computing component includes a first terminal to connect the modular computing component to at least one of a host computing device and another modular computing component. Controller memory of the modular computing component stores information relating to at least one of build level information, revision level information, and generation level information. A controller of the modular computing component transmits the at least one of build level information, revision level information, and generation level information to the host computing device.
Public/Granted literature
- US20210173671A1 MODULAR COMPUTING COMPONENT INFORMATION TRANSMISSION Public/Granted day:2021-06-10
Information query