Invention Grant
- Patent Title: Wiring aggregation apparatus, wiring aggregation system, and contact information transfer method
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Application No.: US16612155Application Date: 2017-05-23
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Publication No.: US11354265B2Publication Date: 2022-06-07
- Inventor: Hiroyuki Ohata , Satoru Ohashi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- International Application: PCT/JP2017/019269 WO 20170523
- International Announcement: WO2018/216120 WO 20181129
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F1/16 ; G06F13/12

Abstract:
A wiring aggregation apparatus includes at least one subunit. The subunit includes: an input/output module to output, to a control module, a first serial signal obtained by performing parallel-serial conversion on plural pieces of contact information collected from devices, and to output, to a corresponding device, each of plural pieces of contact information obtained by performing serial-parallel conversion on a second serial signal acquired from the control module; and the control module to generate a transmit frame by arranging the first serial signal acquired from the input/output module at a defined frame position, to transmit the generated transmit frame to another wiring aggregation apparatus, to extract the second serial signal arranged at a defined frame position from a receive frame acquired from the another wiring aggregation apparatus, and to output the extracted second serial signal to the corresponding input/output module.
Public/Granted literature
- US20210133142A1 WIRING AGGREGATION APPARATUS, WIRING AGGREGATION SYSTEM, AND CONTACT INFORMATION TRANSFER METHOD Public/Granted day:2021-05-06
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