Invention Grant
- Patent Title: RFID tag board, RFID tag, and RFID system
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Application No.: US17269051Application Date: 2019-08-21
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Publication No.: US11354557B2Publication Date: 2022-06-07
- Inventor: Shuichi Yamamoto , Takuya Hayashi
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JPJP2018-155087 20180822
- International Application: PCT/JP2019/032650 WO 20190821
- International Announcement: WO2020/040202 WO 20200227
- Main IPC: G06K19/077
- IPC: G06K19/077

Abstract:
An RFID tag board includes an insulating substrate provided with a first surface conductor, a second surface conductor, a short-circuit part through conductor, a capacitance conductor, a capacitance part through conductor, a first electrode and a second electrode. The short-circuit part through conductor electrically connects the first surface conductor and the second surface conductor. The capacitance conductor faces at least part of one of the first and second surface conductors to form a capacitance element. The capacitance part through conductor electrically connects the capacitance conductor and the other one of the first and second surface conductors. First and second conductors of the capacitance element are electrically connected to the first and second electrodes, respectively, not via the short-circuit part through conductor. A distance from the first electrode to the short-circuit part through conductor is shorter than a distance from the second electrode to the short-circuit part through conductor.
Public/Granted literature
- US20210279543A1 RFID TAG SUBSTRATE, RFID TAG, AND RFID SYSTEM Public/Granted day:2021-09-09
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