Invention Grant
- Patent Title: Contactless smartcards with coupling frames
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Application No.: US16742903Application Date: 2020-01-14
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Publication No.: US11354558B2Publication Date: 2022-06-07
- Inventor: Mustafa Lotya , Darren Molloy , David Finn
- Applicant: AmaTech Group Limited
- Applicant Address: IE Spiddal
- Assignee: AmaTech Group Limited
- Current Assignee: AmaTech Group Limited
- Current Assignee Address: IE Spiddal
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: G06K19/077
- IPC: G06K19/077 ; H01Q1/22

Abstract:
A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard. Various slit designs (configurations, geometries) are described and illustrated. The slit may be filled. The slit may be reinforced.
Public/Granted literature
- US20200257953A1 CONTACTLESS SMARTCARDS WITH COUPLING FRAMES Public/Granted day:2020-08-13
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