- Patent Title: Multilayer capacitor and board including the same mounted thereon
-
Application No.: US16849612Application Date: 2020-04-15
-
Publication No.: US11355287B2Publication Date: 2022-06-07
- Inventor: Sang Jong Lee , Su Bong Jang , Hee Soo Yoon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0167023 20191213
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/012 ; H01G4/228

Abstract:
A multilayer capacitor and a board on which the multilayer capacitor is mounted provide increased capacitor effective area. The multilayer capacitor includes a capacitor body having first and second dielectric layers each with first and second internal electrodes, first and second external electrodes disposed on a surface of the capacitor body, a first via electrode connecting the first internal electrodes to the first external electrode, and a second via electrode connecting the second internal electrodes to the second external electrode. The first and second dielectric layers are alternately stacked in the first direction such that the first internal electrode of the first dielectric layer overlaps the second internal electrode of the second dielectric layer in a first direction, and the second internal electrode of the first dielectric layer overlaps the first internal electrode of the second dielectric layer in the first direction.
Public/Granted literature
- US20210183578A1 MULTILAYER CAPACITOR AND BOARD INCLUDING THE SAME MOUNTED THEREON Public/Granted day:2021-06-17
Information query