Invention Grant
- Patent Title: Plasma processing apparatus and method for plasma processing
-
Application No.: US16416596Application Date: 2019-05-20
-
Publication No.: US11355320B2Publication Date: 2022-06-07
- Inventor: Hiroyuki Matsuura
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JPJP2018-101433 20180528
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01J37/32
Abstract:
A plasma processing apparatus includes a plasma generator provided with a plasma electrode and performs plasma processing on a substrate accommodated in a processing container. At least a region corresponding to the plasma electrode of the plasma generator is formed of synthetic quartz.
Information query
IPC分类:
