A workpiece processing method includes a holding step of holding a workpiece with a front surface of the workpiece directed downward so as to face an upper surface side of a base supplied with a fluid curable resin, a coating step of moving the workpiece downward to press the workpiece against the curable resin, thereby coating the whole of the front surface of the workpiece with the curable resin such that the curable resin enters gaps between bumps and the front surface and the bumps are embedded in the curable resin, a curing step of curing the curable resin to form a resin film, a laser beam applying step of removing the resin film on each street, and a dividing step of supplying a gas plasma to the workpiece to divide the workpiece along each street into individual device chips with the resin film as a mask.