Invention Grant
- Patent Title: Accommodating device for retaining wafers
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Application No.: US17106402Application Date: 2020-11-30
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Publication No.: US11355374B2Publication Date: 2022-06-07
- Inventor: Markus Wimplinger , Thomas Wagenleitner , Alexander Filbert
- Applicant: EV Group E. Thallner GmbH
- Applicant Address: AT St. Florian am Inn
- Assignee: EV Group E. Thallner GmbH
- Current Assignee: EV Group E. Thallner GmbH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kusner & Jaffe
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/683 ; H01L21/67 ; H01L21/66
Abstract:
A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
Public/Granted literature
- US20210104425A1 ACCOMMODATING DEVICE FOR RETAINING WAFERS Public/Granted day:2021-04-08
Information query
IPC分类:
