Invention Grant
- Patent Title: Electrical interconnect structure with radial spokes for improved solder void control
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Application No.: US16774800Application Date: 2020-01-28
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Publication No.: US11355429B2Publication Date: 2022-06-07
- Inventor: Paul Armand Asentista Calo , Tek Keong Gan , Ser Yee Keh , Tien Heng Lem , Fong Lim , Michael Stadler , Mei Qi Tay
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/498 ; H01L21/48 ; H01L23/00 ; H01L21/60
Abstract:
An electrical interconnect structure includes a bond pad having a substantially planar bonding surface, and a solder enhancing structure that is disposed on the bonding surface and includes a plurality of raised spokes that are each elevated from the bonding surface. Each of the raised spokes has a lower wettability relative to a liquefied solder material than the bonding surface. Each of the raised spokes extend radially outward from a center of the solder enhancing structure.
Public/Granted literature
- US20210233839A1 Electrical Interconnect Structure with Radial Spokes for Improved Solder Void Control Public/Granted day:2021-07-29
Information query
IPC分类:
