Invention Grant
- Patent Title: Semiconductor device with patterned ground shielding
-
Application No.: US16882828Application Date: 2020-05-26
-
Publication No.: US11355432B2Publication Date: 2022-06-07
- Inventor: Hsiao-Tsung Yen , Chin-Wei Kuo , Cheng-Wei Luo , Kung-Hao Liang
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group LLC
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L49/02

Abstract:
Semiconductor devices and methods of formation are provided herein. A semiconductor device includes a first inductor, a patterned ground shielding (PGS) proximate the first inductor comprising one or more portions and a first switch configured to couple a first portion of the PGS to a second portion of the PGS. The semiconductor device also has a configuration including a first inductor on a first side of the PGS, a second inductor on a second side of the PGS and a first switch configured to couple a first portion of the PGS to a second portion of the PGS. Selective coupling of portions of the PGS by activating or deactivating switches alters the behavior of the first inductor, or the behavior and interaction between the first inductor and the second inductor. A mechanism is thus provided for selectively configuring a PGS to control inductive or other properties of a circuit.
Public/Granted literature
- US20200286826A1 SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING Public/Granted day:2020-09-10
Information query
IPC分类: