- Patent Title: Semiconductor device and fabrication method of semiconductor device
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Application No.: US17041852Application Date: 2019-04-04
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Publication No.: US11355530B2Publication Date: 2022-06-07
- Inventor: Shunpei Yamazaki , Yuichi Sato , Hitoshi Nakayama
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi
- Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee Address: JP Atsugi
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JPJP2018-076694 20180412,JPJP2018-076752 20180412
- International Application: PCT/IB2019/052744 WO 20190404
- International Announcement: WO2019/197946 WO 20191017
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/24 ; H01L27/108

Abstract:
A semiconductor device including: a first insulator in which an opening is formed; a first conductor positioned in the opening; a first oxide over the first insulator; a second oxide over the first oxide; a third oxide and a fourth oxide over the second oxide; a second conductor over the third oxide and the first conductor; a third conductor over the fourth oxide; a fifth oxide over the second oxide; a second insulator over the fifth oxide; and a fourth conductor positioned over the second insulator and overlapping with the fifth oxide. The fifth oxide is in contact with each of a side surface of the third oxide and a side surface of the fourth oxide. The conductivity of the third oxide is higher than the conductivity of the second oxide. The second conductor is in contact with the top surface of the first conductor.
Public/Granted literature
- US20210020667A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2021-01-21
Information query
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