Invention Grant
- Patent Title: High density interconnect for segmented LEDs
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Application No.: US16230673Application Date: 2018-12-21
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Publication No.: US11355549B2Publication Date: 2022-06-07
- Inventor: Frederic Stephane Diana , Alan Andrew McReynolds
- Applicant: Lumileds LLC
- Applicant Address: US CA San Jose
- Assignee: Lumileds LLC
- Current Assignee: Lumileds LLC
- Current Assignee Address: US CA San Jose
- Agency: Servilla Whitney LLC
- Priority: EP18164702 20180328
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/42 ; H01L25/075 ; H01L33/00 ; H01L33/38 ; H01L33/62 ; H01L33/46
Abstract:
A light emitting diode (LED) may include a conductive via in a first portion of an epitaxial layer and a first contact on a second portion of the epitaxial layer. The first portion and the second portion may be separated by an isolation region. The LED may include a transparent conductive layer on the epitaxial layer.
Public/Granted literature
- US20190206926A1 HIGH DENSITY INTERCONNECT FOR SEGMENTED LEDS Public/Granted day:2019-07-04
Information query
IPC分类:
