Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US17139130Application Date: 2020-12-31
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Publication No.: US11355595B2Publication Date: 2022-06-07
- Inventor: Motoyoshi Kubouchi
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JPJP2019-007329 20190118
- Main IPC: H01L29/32
- IPC: H01L29/32 ; H01L21/265 ; H01L21/324 ; H01L27/07 ; H01L29/36 ; H01L29/739

Abstract:
Directly beneath p−-type base regions, n-type storage regions are provided. The storage regions contain hydrogen donors as an impurity and have an impurity concentration higher than that of the n−-type drift region. The storage regions are formed by hydrogen ion irradiation from a back surface of a semiconductor substrate. The storage regions have a peak hydrogen concentration and are at positions that coincide with where the hydrogen ions have been irradiated. By the hydrogen ion irradiation, a crystal defect region that is a carrier lifetime killer region is formed concurrently with the storage regions, closer to the back surface of the semiconductor substrate than are storage regions. The crystal defect region has a crystal defect density with a peak density at a position closer to the back surface of the semiconductor substrate than are the storage regions. A semiconductor device having such storage regions and a carrier lifetime killer region is enabled.
Public/Granted literature
- US20210126092A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2021-04-29
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