Semiconductor device and method of manufacturing semiconductor device
Abstract:
Directly beneath p−-type base regions, n-type storage regions are provided. The storage regions contain hydrogen donors as an impurity and have an impurity concentration higher than that of the n−-type drift region. The storage regions are formed by hydrogen ion irradiation from a back surface of a semiconductor substrate. The storage regions have a peak hydrogen concentration and are at positions that coincide with where the hydrogen ions have been irradiated. By the hydrogen ion irradiation, a crystal defect region that is a carrier lifetime killer region is formed concurrently with the storage regions, closer to the back surface of the semiconductor substrate than are storage regions. The crystal defect region has a crystal defect density with a peak density at a position closer to the back surface of the semiconductor substrate than are the storage regions. A semiconductor device having such storage regions and a carrier lifetime killer region is enabled.
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