Invention Grant
- Patent Title: Semiconductor devices with backside power rail and backside self-aligned via
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Application No.: US17080521Application Date: 2020-10-26
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Publication No.: US11355601B2Publication Date: 2022-06-07
- Inventor: Kuo-Cheng Chiang , Shi Ning Ju , Kuan-Lun Cheng , Chih-Hao Wang , Cheng-Chi Chuang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L23/528 ; H01L23/522 ; H01L29/786 ; H01L29/423 ; H01L29/66 ; H01L29/40 ; H01L29/06

Abstract:
A semiconductor structure includes a source feature, a drain feature, one or more channel layers connecting the source feature and the drain feature, and a gate structure between the source feature and the drain feature. The gate structure engages each of the one or more channel layers. The semiconductor structure further includes a first source silicide feature over the source feature, a source contact over the first source silicide feature, a second source silicide feature under the source feature, a via under the second source silicide feature, and a power rail under the via. The first and the second source silicide features fully surround the source feature in a cross-sectional view. The power rail is a backside power rail.
Public/Granted literature
- US20210305381A1 SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND BACKSIDE SELF-ALIGNED VIA Public/Granted day:2021-09-30
Information query
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