Invention Grant
- Patent Title: Semiconductor device structure and method for forming the same
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Application No.: US17028683Application Date: 2020-09-22
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Publication No.: US11355605B2Publication Date: 2022-06-07
- Inventor: Tung-Ying Lee , Kai-Tai Chang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L27/088 ; H01L21/8234 ; H01L29/423 ; H01L29/78 ; H01L29/06 ; H01L29/40 ; H01L29/66

Abstract:
A method for forming a semiconductor device structure is provided. The method includes providing a substrate, a first nanostructure, and a second nanostructure. The method includes forming an isolation layer over the base. The method includes forming a gate dielectric layer over the first nanostructure, the second nanostructure, the fin, and the isolation layer. The method includes forming a gate electrode layer over the first part. The method includes forming a spacer layer. The method includes removing the second part of the gate dielectric layer and the first upper portion of the isolation layer to form a space between the fin and the spacer layer. The method includes forming a source/drain structure in the space and over the first nanostructure and the second nanostructure.
Public/Granted literature
- US20210134970A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2021-05-06
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