Invention Grant
- Patent Title: Wafer-scale integration of dopant atoms for donor- or acceptor-based spin qubits
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Application No.: US15924407Application Date: 2018-03-19
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Publication No.: US11355623B2Publication Date: 2022-06-07
- Inventor: Lester Lampert , James S. Clarke , Jeanette M. Roberts , Ravi Pillarisetty , David J. Michalak , Kanwaljit Singh , Roman Caudillo , Hubert C. George , Zachary R. Yoscovits , Nicole K. Thomas
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/82 ; H01L29/49 ; H01L29/40 ; G06N10/00 ; H01L29/423 ; H01L21/266 ; B82Y10/00 ; H01L29/76 ; H01L21/265 ; B82Y30/00 ; B82Y40/00

Abstract:
Embodiments of the present disclosure describe a method of fabricating spin qubit device assemblies that utilize dopant-based spin qubits, i.e. spin qubit devices which operate by including a donor or an acceptor dopant atom in a semiconductor host layer. The method includes, first, providing a pair of gate electrodes over a semiconductor host layer, and then providing a window structure between the first and second gate electrodes, the window structure being a continuous solid material extending between the first and second electrodes and covering the semiconductor host layer except for an opening through which a dopant atom is to be implanted in the semiconductor host layer. By using a defined gate-first process, the method may address the scalability challenges and create a deterministic path for fabricating dopant-based spin qubits in desired locations, promoting wafer-scale integration of dopant-based spin qubit devices for use in quantum computing devices.
Public/Granted literature
- US20190043968A1 WAFER-SCALE INTEGRATION OF DOPANT ATOMS FOR DONOR- OR ACCEPTOR-BASED SPIN QUBITS Public/Granted day:2019-02-07
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