Invention Grant
- Patent Title: Merged source/drain features
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Application No.: US17201147Application Date: 2021-03-15
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Publication No.: US11355641B2Publication Date: 2022-06-07
- Inventor: Chun-An Lin , Wei-Yuan Lu , Feng-Cheng Yang , Tzu-Ching Lin , Li-Li Su
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/092 ; H01L21/8238 ; H01L29/66 ; H01L21/02 ; A61B5/15 ; G01N1/14 ; G01N33/49 ; H01L29/04

Abstract:
The present application provides a semiconductor device and the method of making the same. The method includes recessing a fin extending from a substrate, forming a base epitaxial feature on the recessed fin, forming a bar-like epitaxial feature on the base epitaxial feature, and forming a conformal epitaxial feature on the bar-like epitaxial feature. The forming of the bar-like epitaxial feature includes in-situ doping the bar-like epitaxial feature with an n-type dopant at a first doping concentration. The forming of the conformal epitaxial feature includes in-situ doping the conformal epitaxial feature with a second doping concentration greater than the first doping concentration.
Public/Granted literature
- US20210202733A1 Merged Source/Drain Features Public/Granted day:2021-07-01
Information query
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