Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US17149464Application Date: 2021-01-14
-
Publication No.: US11355651B2Publication Date: 2022-06-07
- Inventor: Masatoshi Aketa , Yuta Yokotsuji
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agent Gregory M. Howison
- Priority: JP2011-165660 20110728
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L29/06 ; H01L29/861 ; H01L29/16 ; H01L29/20 ; H01L23/535 ; H01L29/36 ; H01L29/08 ; H01L29/66

Abstract:
The semiconductor device of the present invention includes a first conductivity type semiconductor layer made of a wide bandgap semiconductor and a Schottky electrode formed to come into contact with a surface of the semiconductor layer, and has a threshold voltage Vth of 0.3 V to 0.7 V and a leakage current Jr of 1×10−9 A/cm2 to 1×10−4 A/cm2 in a rated voltage VR.
Public/Granted literature
- US20210135017A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-05-06
Information query
IPC分类: