Invention Grant
- Patent Title: Photosensitive module
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Application No.: US16851808Application Date: 2020-04-17
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Publication No.: US11355656B2Publication Date: 2022-06-07
- Inventor: Chen-Er Hsu , Sin-Jhong Song , Chi-Fu Wu , Hao-Yu Wu , Tsutomu Fukai , Ming-Hung Wu
- Applicant: TDK TAIWAN CORP.
- Applicant Address: TW Taoyuan
- Assignee: TDK TAIWAN CORP.
- Current Assignee: TDK TAIWAN CORP.
- Current Assignee Address: TW Taoyuan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: A61B5/11
- IPC: A61B5/11 ; A61B5/103 ; A61B5/00 ; H01L31/0232 ; H01L31/113 ; H01L31/0236 ; H01L31/02 ; H01L27/146 ; H01L31/0224 ; H01L31/024 ; G03B5/00 ; H04N5/225 ; G03B5/02 ; G03B5/04 ; G02B7/182 ; H02K11/21 ; G02B7/09 ; G02B27/64 ; G03B13/36 ; H02K41/035 ; G02B7/00 ; H01L23/00 ; G02B13/00
Abstract:
A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the base, and the photosensitive element is configured to receive a light beam traveling along an optical axis.
Public/Granted literature
- US20200335539A1 PHOTOSENSITIVE MODULE Public/Granted day:2020-10-22
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