Invention Grant
- Patent Title: Photonic materials
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Application No.: US16763356Application Date: 2018-11-12
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Publication No.: US11355668B2Publication Date: 2022-06-07
- Inventor: Hongping Zhao , Md Rezaul Karim
- Applicant: Ohio State Innovation Foundation
- Applicant Address: US OH Columbus
- Assignee: Ohio State Innovation Foundation
- Current Assignee: Ohio State Innovation Foundation
- Current Assignee Address: US OH Columbus
- Agency: Meunier Carlin & Curfman LLC
- International Application: PCT/US2018/060571 WO 20181112
- International Announcement: WO2019/094866 WO 20190516
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L33/26 ; H01L33/32

Abstract:
Disclosed herein are photonic materials. The photonic materials can comprise: a first layer comprising InxGa1-xN, wherein x is from 0 to 0.5; a second layer comprising ZnSnN2; and a third layer comprising InyGa1-yN, wherein y is from 0 to 0.5; wherein the second layer is disposed between and in contact with the first layer and the third layer, such that the second layer is sandwiched between the first layer and the third layer. In some examples, the photonic materials can be sandwiched between two or more barrier layers to form a quantum well.
Public/Granted literature
- US20200295226A1 PHOTONIC MATERIALS Public/Granted day:2020-09-17
Information query
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