Invention Grant
- Patent Title: Method of manufacturing light emitting device and light emitting device
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Application No.: US16842661Application Date: 2020-04-07
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Publication No.: US11355682B2Publication Date: 2022-06-07
- Inventor: Dai Wakamatsu
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Global IP Counselors, LLP
- Priority: JPJP2019-080754 20190422
- Main IPC: H01L33/58
- IPC: H01L33/58 ; H01L25/075 ; H01L33/50 ; H01L33/60

Abstract:
A method of manufacturing a light emitting device includes: forming light-shielding films respectively on an upper surface of a light-transmissive plate and a lower surface of the light-transmissive plate opposite to the upper surface; dividing the light-transmissive plate together with the light-shielding films from the upper surface to the lower surface or from the lower surface to the upper surface, to form a plurality of plate-shaped optical components; and fixing a cut surface of each of the optical components to a corresponding one of a plurality of light emitting elements, and arranging the light emitting elements on a substrate in a row or in a matrix so that the cut surfaces of the optical components and the light-shielding films are alternately arranged along a row direction in a lateral side view as seen in a direction parallel to the substrate and perpendicular to the row direction.
Public/Granted literature
- US20200335676A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE Public/Granted day:2020-10-22
Information query
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