Invention Grant
- Patent Title: Graphite-laminated chip-on-film-type semiconductor package having improved heat dissipation and electromagnetic wave shielding functions
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Application No.: US16640643Application Date: 2018-08-21
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Publication No.: US11355687B2Publication Date: 2022-06-07
- Inventor: Hag Mo Kim
- Applicant: Hag Mo Kim
- Applicant Address: KR Yongin-Si
- Assignee: Hag Mo Kim
- Current Assignee: Hag Mo Kim
- Current Assignee Address: KR Yongin-Si
- Agency: Polsinelli PC
- Priority: KR10-2017-0105442 20170821
- International Application: PCT/KR2018/009623 WO 20180821
- International Announcement: WO2019/039847 WO 20190228
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L33/64 ; G02F1/1345 ; H01L23/00 ; H01L23/498 ; H01L23/552 ; G02F1/1333
Abstract:
The present invention relates to a chip-on film type semiconductor package including an integrated circuit chip, a printed circuit board layer, and a graphite layer, in which the integrated circuit chip is connected to one surface of the printed circuit board layer directly or by means of a mounting element and the graphite layer is laminated on an opposite surface of the printed circuit board layer and a display device including the same.
Public/Granted literature
Information query
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