Invention Grant
- Patent Title: Resistive random access memory and manufacturing method thereof
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Application No.: US17037039Application Date: 2020-09-29
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Publication No.: US11355704B2Publication Date: 2022-06-07
- Inventor: Huaqiang Wu , Wei Wu , Bin Gao , He Qian
- Applicant: Tsinghua University
- Applicant Address: CN Beijing
- Assignee: Tsinghua University
- Current Assignee: Tsinghua University
- Current Assignee Address: CN Beijing
- Agency: Loeb & Loeb LLP
- Priority: CN201710801908.6 20170907
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
A resistive random access memory and a manufacture method thereof are provided. The resistive random access memory includes: a first electrode, a second electrode, a resistive layer between the first electrode and the second electrode, and at least one thermal enhanced layer; the thermal enhanced layer is adjacent to the resistive layer, and a thermal conductivity of the thermal enhanced layer is less than a thermal conductivity of the first electrode and a thermal conductivity of the second electrode.
Public/Granted literature
- US20210028358A1 RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-01-28
Information query
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