Invention Grant
- Patent Title: Multi-layer contact plate configured to establish electrical bonds to battery cells in a battery module
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Application No.: US17100492Application Date: 2020-11-20
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Publication No.: US11355819B2Publication Date: 2022-06-07
- Inventor: Heiner Fees , Andreas Track , Alexander Eichhorn , Ralf Maisch , Jörg Damaske , Martin Eberhard
- Applicant: Tiveni MergeCo, Inc.
- Applicant Address: US CA San Mateo
- Assignee: Tiveni MergeCo, Inc.
- Current Assignee: Tiveni MergeCo, Inc.
- Current Assignee Address: US CA San Mateo
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Agent Daniel Podhajny
- Main IPC: H01M50/00
- IPC: H01M50/00 ; H01M50/502 ; B23K26/21 ; B60L50/64 ; B60L58/21 ; B60K1/00 ; B60K1/04 ; B62D21/15 ; H01M50/10 ; H01M50/20 ; H01M50/56 ; H01M50/116 ; H01M50/152 ; H01M50/166 ; H01M50/528 ; H01M50/529 ; H01M50/543 ; H01M50/545 ; H01M50/522 ; H01M50/516 ; H01M50/107 ; H01M50/171 ; H01M50/147 ; H01M10/613 ; H01M10/625 ; B23K26/26 ; B23K101/36 ; H01M10/643 ; H01M10/6552 ; B23K101/38 ; B62D21/18 ; F16M1/00 ; H01M50/572

Abstract:
An embodiment is directed to a multi-layer contact plate configured to establish electrical bonds to battery cells in a battery module. The multi-layer contact plate includes two or more primary conductive layers (e.g., Al, Cu, etc.), and a cell terminal connection layer (e.g., steel, Al, Cu, etc.) that is joined with, and sandwiched by, the two or more primary conductive layers. A portion of the cell terminal connection layer is configured to form a set of bonding connectors (e.g., bonding ribbons) to provide a direct electrical bond between the multi-layer contact plate and terminals (e.g., positive terminals, negative terminals, or a combination thereof) of at least one group of battery cells (e.g., a single group of battery cells, two groups of battery cells that are connected in series, etc.).
Public/Granted literature
- US20210104718A1 MULTI-LAYER CONTACT PLATE CONFIGURED TO ESTABLISH ELECTRICAL BONDS TO BATTERY CELLS IN A BATTERY MODULE Public/Granted day:2021-04-08
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