A vertical cavity surface emitting laser (VCSEL) die package includes a bottom substrate comprising a bottom contact pad electrically contacting a bottom electrode on a bottom surface of a VCSEL die. The VCSEL die package includes a submount including a submount contact pad electrically contacting a first electrode on another surface of the VCSEL die. The submount contact pad overlaps a portion of the first electrode, wherein the VCSEL die is positioned between the submount and the bottom substrate.