Invention Grant
- Patent Title: Impedance matching device and impedance matching method
-
Application No.: US17328121Application Date: 2021-05-24
-
Publication No.: US11356074B2Publication Date: 2022-06-07
- Inventor: Tatsuya Morii
- Applicant: DAIHEN Corporation
- Applicant Address: JP Osaka
- Assignee: DAIHEN Corporation
- Current Assignee: DAIHEN Corporation
- Current Assignee Address: JP Osaka
- Agency: Bozicevic, Field & Francis LLP
- Agent Rudy J. Ng; Bret E. Field
- Priority: JPJP2018-243192 20181226
- Main IPC: H03H7/38
- IPC: H03H7/38 ; H01J37/32

Abstract:
An impedance matching device comprises a variable capacitor including multiple capacitance elements and connected in parallel having capacitors and each having one end connected in series to a high-frequency power source and semiconductor switches and connected to the respective capacitors, and a control unit. The control unit derives a reflection coefficient based on the obtained information concerning an impedance viewed from the high-frequency power source toward the load side, updates the states of the respective semiconductor switches and included in the multiple capacitance elements and with a first cycle in the case where the reflection coefficient is equal to or more than a predetermined value, and updates the states of the respective semiconductor switches and included in the plurality of capacitance elements and with a second cycle longer than the first cycle in the case where the reflection coefficient is less than the predetermined value.
Public/Granted literature
- US20210281235A1 Impedance Matching Device and Impedance Matching Method Public/Granted day:2021-09-09
Information query