Invention Grant
- Patent Title: Radio frequency module and communication device
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Application No.: US17114504Application Date: 2020-12-08
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Publication No.: US11356132B2Publication Date: 2022-06-07
- Inventor: Takanori Uejima
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2018-111070 20180611
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/40 ; H04B1/10 ; H04B1/00 ; H04W52/24 ; H04W52/52 ; H04W88/06
Abstract:
A radio frequency module includes a module board, a transmission power amplifier, a first inductance element mounted on a first principal surface and connected to an output terminal of the transmission power amplifier, a reception low-noise amplifier, and a second inductance element mounted on a first principal surface connected to an input terminal of the reception low-noise amplifier. In a plan view of the module board, a conductive member mounted on the first principal surface is disposed between the first inductance element and the second inductance element.
Public/Granted literature
- US20210152202A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-05-20
Information query
