Invention Grant
- Patent Title: Short link efficient interconnect circuitry
-
Application No.: US17214171Application Date: 2021-03-26
-
Publication No.: US11356303B2Publication Date: 2022-06-07
- Inventor: Hsinho Wu , Masashi Shimanouchi , Peng Li
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Fletcher Yoder P.C.
- Main IPC: H04J14/02
- IPC: H04J14/02 ; H04L25/03 ; H04L25/14 ; G06N20/00 ; H03H21/00

Abstract:
Systems and methods for electronic devices including two or more semiconductor devices coupled via an interconnect. The interconnect includes multiple lanes each having a link between the first and second semiconductor devices. One or more lanes of the multiple lanes each include clock and data recovery circuitry to perform full clock and data recovery. One or more other lanes of the multiple lanes each do not include clock and data recovery circuitry and instead includes a phase adjustment and clock multiplier circuit that is slave to clock and data recovery circuitry of the one or more lanes.
Public/Granted literature
- US20210218603A1 Short Link Efficient Interconnect Circuitry Public/Granted day:2021-07-15
Information query