Invention Grant
- Patent Title: Semiconductor manufacturing system and server device
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Application No.: US16354336Application Date: 2019-03-15
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Publication No.: US11356538B2Publication Date: 2022-06-07
- Inventor: Miki Ouchi , Yuichi Fukuchi , Masahiro Miya
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JPJP2018-050103 20180316
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H04L67/01 ; G05B19/4155 ; H04L67/06

Abstract:
A semiconductor manufacturing system according to an embodiment includes: a controller configured to control a semiconductor manufacturing apparatus; and a server configured to bidirectionally communicate with the controller via a communication line. The server includes a first processor configured to: transmit a backup file creation request (signal) that sets data specific to each controller as a backup file and transmit a backup file acquisition request (signal) requesting acquisition of the created backup file; and receive the created backup file. The controller includes a second processor configured to: receive a request (signal) from the server; and create the backup file when receiving the backup file creation request (signal).
Public/Granted literature
- US20190289099A1 SEMICONDUCTOR MANUFACTURING SYSTEM AND SERVER DEVICE Public/Granted day:2019-09-19
Information query
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