Invention Grant
- Patent Title: Vibration removal apparatus and method for dual-microphone earphones
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Application No.: US17079438Application Date: 2020-10-24
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Publication No.: US11356765B2Publication Date: 2022-06-07
- Inventor: Lei Zhang , Fengyun Liao , Xin Qi
- Applicant: SHENZHEN SHOKZ CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: SHENZHEN SHOKZ CO., LTD.
- Current Assignee: SHENZHEN SHOKZ CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: Metis IP LLC
- Main IPC: G10K11/178
- IPC: G10K11/178 ; H04R1/10

Abstract:
The present disclosure provides a microphone apparatus. The microphone apparatus may include a microphone and a vibration sensor. The microphone may be configured to receive a first signal including a voice signal and a first vibration signal. The vibration sensor may be configured to receive a second vibration signal. And the microphone and the vibration sensor are configured such that the first vibration signal may be offset with the second vibration signal.
Public/Granted literature
- US20210044890A1 VIBRATION REMOVAL APPARATUS AND METHOD FOR DUAL-MICROPHONE EARPHONES Public/Granted day:2021-02-11
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