Invention Grant
- Patent Title: Double inductor integrated power module for high current applications
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Application No.: US16551334Application Date: 2019-08-26
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Publication No.: US11357101B2Publication Date: 2022-06-07
- Inventor: Sunil M. Akre , Kejiu Zhang
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: BakerHostetler
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/02 ; H05K1/18 ; H01F27/28 ; H01F27/24 ; H01F41/04 ; H05K3/30 ; H01F27/40

Abstract:
The disclosed technology relates to a power supply circuit that utilizes an integrated power module that has a first and second power converter disposed on opposite sides of an inductor core. The power supply circuit includes an inductor core comprising a plurality of nano-magnetic layers embedded within a printed circuit board, a first winding disposed on a first outer surface of the inductor core, a second winding disposed on a second outer surface of the inductor core, a first active layer disposed on an outer surface of the first winding, a second active layer disposed on an outer surface of the second winding, a first capacitor tile disposed on an outer surface of the first active layer, and a second capacitor tile disposed on an outer surface of the second active layer.
Public/Granted literature
- US20200296824A1 DOUBLE INDUCTOR INTEGRATED POWER MODULE FOR HIGH CURRENT APPLICATIONS Public/Granted day:2020-09-17
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