Invention Grant
- Patent Title: Memory system
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Application No.: US17120980Application Date: 2020-12-14
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Publication No.: US11357106B2Publication Date: 2022-06-07
- Inventor: Hiroaki Komaki
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2020-146386 20200831
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
According to one embodiment, in a memory system, a printed circuit board a first end portion and a second end portion. The second end portion is a portion arranged in an opposite side of the first end portion. Both of a semiconductor memory and a controller are disposed on the first surface. A edge connector is connectable to a host device and is disposed in the first end portion. Plural through-hole portions are disposed in the second end portion. Each of the plural through-hole portions penetrates from the first surface to the second surface. Each of the plural through-hole portions has an inner surface covered with an electrically-conductive film. Plural pad electrodes are disposed on the second surface in the second end portion. At least some of the plural through-hole portions are electrically connected to the controller. At least some of the plural pad electrodes are electrically connected to the controller.
Public/Granted literature
- US20220071008A1 MEMORY SYSTEM Public/Granted day:2022-03-03
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