Invention Grant
- Patent Title: Circuit board and electronic device including circuit board
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Application No.: US17133380Application Date: 2020-12-23
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Publication No.: US11357107B2Publication Date: 2022-06-07
- Inventor: Bumhee Bae , Sungsoo Kim , Kwangmo Yang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2019-0174425 20191224
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02

Abstract:
An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of ground patterns include a meander form at the first portion.
Public/Granted literature
- US20210195739A1 CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD Public/Granted day:2021-06-24
Information query