Invention Grant
- Patent Title: Electrical component enclosure and method of use
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Application No.: US17018145Application Date: 2020-09-11
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Publication No.: US11357120B2Publication Date: 2022-06-07
- Inventor: Dejan Raic , Steven Christopher Farmer
- Applicant: Phoenix Contact Development and Manufacturing, Inc.
- Applicant Address: US PA Middletown
- Assignee: Phoenix Contact Development and Manufacturing, Inc.
- Current Assignee: Phoenix Contact Development and Manufacturing, Inc.
- Current Assignee Address: US PA Middletown
- Agency: Hooker & Habib, P.C.
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/02 ; H05K7/14
Abstract:
An enclosure assembly for housing printed circuit boards and related electrical components having a secured faceplate that may be removed by use of a hand tool.
Public/Granted literature
- US20220087042A1 Electrical Component Enclosure and Method of Use Public/Granted day:2022-03-17
Information query
