Invention Grant
- Patent Title: Component supply device and component mounting device
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Application No.: US16161051Application Date: 2018-10-16
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Publication No.: US11357144B2Publication Date: 2022-06-07
- Inventor: Hideaki Watanabe , Dai Yokoyama , Shigeki Imafuku , Yosuke Nagasawa , Satoshi Matsuoka , Kazuo Nagae
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-210681 20171031
- Main IPC: H05K13/02
- IPC: H05K13/02 ; H05K13/04 ; H05K13/08 ; B21C1/00

Abstract:
A component supply device includes a transport path that guides a component connected body from a component insertion port on an upstream side in a component feeding direction to a component supply position on a downstream side, the component connected body including a plurality of axial components arranged and connected at a predetermined pitch, the plurality of axial components each having a lead, and a feed mechanism that pitch-feeds the component connected body along the transport path to the downstream side. The feed mechanism includes a feed member which has a plurality of feed hooks disposed at the predetermined pitch along the component feeding direction, a rotating shaft which is connected to one end side of the feed member, and a moving mechanism which is connected to the feed member through the rotating shaft and reciprocates the rotating shaft along the component feeding direction. A length of one feed hook among the plurality of feed hooks is longer than a length of an other feed hook among the plurality of feed hooks, the other feed hook being adjacent to the one feed hook on the rotating shaft side.
Public/Granted literature
- US20190133007A1 COMPONENT SUPPLY DEVICE, COMPONENT MOUNTING DEVICE, AND METHOD OF MANUFACTURING MOUNTING BOARD Public/Granted day:2019-05-02
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