Invention Grant
- Patent Title: Endoscope tip attachment device
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Application No.: US16487881Application Date: 2018-04-19
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Publication No.: US11357387B2Publication Date: 2022-06-14
- Inventor: Noriyuki Sugita
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- International Application: PCT/JP2018/016220 WO 20180419
- International Announcement: WO2018/194146 WO 20181025
- Main IPC: A61B1/00
- IPC: A61B1/00 ; A61B1/05 ; A61B1/005 ; A61B1/273

Abstract:
Embodiments of the disclosure include an endoscope tip assembly for use on an endoscope, during procedures. The endoscope tip assembly may include a base configured to receive an endoscope tip configured to not disengage from the endoscope tip during a procedure. The endoscope tip assembly may also include a plurality of struts which is connected by a webbing, may fold flat during insertion, and may assume a balloon-like shape during withdrawal.
Public/Granted literature
- US20200037854A1 ENDOSCOPE TIP ATTACHMENT DEVICE Public/Granted day:2020-02-06
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